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Copper Clad Fr4 Printed Electronic Circuit Board 2 Layer PCB HAL Lead Free

Witgain Technology Limited
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    Buy cheap Copper Clad Fr4 Printed Electronic Circuit Board 2 Layer PCB HAL Lead Free from wholesalers
     
    Buy cheap Copper Clad Fr4 Printed Electronic Circuit Board 2 Layer PCB HAL Lead Free from wholesalers
    • Buy cheap Copper Clad Fr4 Printed Electronic Circuit Board 2 Layer PCB HAL Lead Free from wholesalers
    • Buy cheap Copper Clad Fr4 Printed Electronic Circuit Board 2 Layer PCB HAL Lead Free from wholesalers
    • Buy cheap Copper Clad Fr4 Printed Electronic Circuit Board 2 Layer PCB HAL Lead Free from wholesalers

    Copper Clad Fr4 Printed Electronic Circuit Board 2 Layer PCB HAL Lead Free

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    Brand Name : WITGAIN PCB
    Model Number : PCB000372
    Certification : UL
    Price : negotiable
    Payment Terms : T/T
    Supply Ability : 100kpcs/Month
    Delivery Time : 10 days
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    Copper Clad Fr4 Printed Electronic Circuit Board 2 Layer PCB HAL Lead Free

    Printed Circuit Boards 2 Layer PCB With HAL Lead Free


    PCB Specifications:


    1 2 Layer FR4 substrate material printed circuit board.

    2 Double layer copper, copper thickness is 35um/35um.

    3 Finished pcb thickness is 1.2mm.

    4 2 layer pcb with 4/4mil min line space and width.

    5 Green solder mask and white silkscreen.

    6 Need customer to send us the gerber file or PCB file

    7 ROHS, MSDS, SGS, UL, ISO9001&ISO14001 Certificated


    S1130 Data Sheet:


    S1130
    ItemsMethodConditionUnitTypical Value
    TgIPC-TM-650 2.4.25DSC135
    TdIPC-TM-650 2.4.24.65% wt. loss310
    CTE (Z-axis)IPC-TM-650 2.4.24Before Tgppm/℃65
    After Tgppm/℃310
    50-260℃%4.5
    T260IPC-TM-650 2.4.24.1TMAmin13
    T288IPC-TM-650 2.4.24.1TMAmin<1
    Thermal StressIPC-TM-650 2.4.13.1288℃, solder dip--60S No Delamination
    Volume ResistivityIPC-TM-650 2.5.17.1After moisture resistanceMΩ.cm4.8E + 08
    E-24/125MΩ.cm4.6E + 06
    Surface ResistivityIPC-TM-650 2.5.17.1After moisture resistance5.2E + 07
    E-24/1255.3E + 06
    Arc ResistanceIPC-TM-650 2.5.1D-48/50+D-4/23s120
    Dielectric BreakdownIPC-TM-650 2.5.6D-48/50+D-4/23kV60
    Electrical StrengthIPC-TM-650 2.5.6.2D-48/50+D-4/23kV/mm
    Dissipation Constant (Dk)IPC-TM-650 2.5.5.91MHz--4.6
    IEC 61189-2-72110GHz--
    Dissipation Factor (Df)IPC-TM-650 2.5.5.91MHz--0.016
    IEC 61189-2-72110GHz--
    Peel Strength(1oz HTE copper foil)IPC-TM-650 2.4.8AN/mm
    After thermal Stress 288℃,10sN/mm1.8
    125℃N/mm1.6
    Flexural StrengthLWIPC-TM-650 2.4.4AMPa600
    CWIPC-TM-650 2.4.4AMPa500
    Water AbsorptionIPC-TM-650 2.6.2.1E-1/105+D-24/23%0.15
    CTIIEC30112C-48/23/50,PLC 3
    FlammabilityUL94C-48/23/50RatingV-0
    E-24/125RatingV-0

    Multilayer PCB Process:


    Quality Copper Clad Fr4 Printed Electronic Circuit Board 2 Layer PCB HAL Lead Free for sale
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