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1.6 MM Thickness PCB Electronic Board Half Hole FR4 Substrate 6 Layer PCB GPS Module

Witgain Technology Limited
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    Buy cheap 1.6 MM Thickness PCB Electronic Board Half Hole FR4 Substrate 6 Layer PCB GPS Module from wholesalers
     
    Buy cheap 1.6 MM Thickness PCB Electronic Board Half Hole FR4 Substrate 6 Layer PCB GPS Module from wholesalers
    • Buy cheap 1.6 MM Thickness PCB Electronic Board Half Hole FR4 Substrate 6 Layer PCB GPS Module from wholesalers
    • Buy cheap 1.6 MM Thickness PCB Electronic Board Half Hole FR4 Substrate 6 Layer PCB GPS Module from wholesalers
    • Buy cheap 1.6 MM Thickness PCB Electronic Board Half Hole FR4 Substrate 6 Layer PCB GPS Module from wholesalers
    • Buy cheap 1.6 MM Thickness PCB Electronic Board Half Hole FR4 Substrate 6 Layer PCB GPS Module from wholesalers
    • Buy cheap 1.6 MM Thickness PCB Electronic Board Half Hole FR4 Substrate 6 Layer PCB GPS Module from wholesalers

    1.6 MM Thickness PCB Electronic Board Half Hole FR4 Substrate 6 Layer PCB GPS Module

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    Brand Name : WITGAIN PCB
    Model Number : Half hole PCB0005
    Certification : UL
    Price : negotiable
    Payment Terms : T/T
    Supply Ability : 100k pcs/month
    Delivery Time : 20 days
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    1.6 MM Thickness PCB Electronic Board Half Hole FR4 Substrate 6 Layer PCB GPS Module

    Half Hole PCB FR4 Substrate 6 Layer PCB GPS Modole Used 1.6 MM Thickness


    Requirements:


    1 All dimensions are in MM.

    2 Fabricate per IPC-6012A Class2.

    3 Materials:

    3.1 Dielectric: FR4 Per IPC or equivalent

    3.2 Min Tg: 170DEG

    3.3 Copper: As per stack up

    3.4 UL Rating: 94V0 Minimum

    4 Surface finish: ENIG

    5 Solder mask material should meet all requirement of the IPC-SM-840E and shall be green in color and applied over bare copper. Vendor may edit solder mask and paste mask as needed.

    6 Editing of existing copper layers shall require customer approval.

    7 Silkscreen legend to be applied per layer stackup using white non-conductitive epoxy ink.


    Layer Stackup:


    Material Data Sheet:
    S1000-2
    ItemsMethodConditionUnitTypical Value
    TgIPC-TM-650 2.4.25DSC180
    IPC-TM-650 2.4.24.4DMA185
    TdIPC-TM-650 2.4.24.65% wt. loss345
    CTE (Z-axis)IPC-TM-650 2.4.24Before Tgppm/℃45
    After Tgppm/℃220
    50-260℃%2.8
    T260IPC-TM-650 2.4.24.1TMAmin60
    T288IPC-TM-650 2.4.24.1TMAmin20
    T300IPC-TM-650 2.4.24.1TMAmin5
    Thermal StressIPC-TM-650 2.4.13.1288℃, solder dip--100S No Delamination
    Volume ResistivityIPC-TM-650 2.5.17.1After moisture resistanceMΩ.cm2.2 x 108
    E-24/125MΩ.cm4.5 x 106
    Surface ResistivityIPC-TM-650 2.5.17.1After moisture resistance7.9 x 107
    E-24/1251.7 x 106
    Arc ResistanceIPC-TM-650 2.5.1D-48/50+D-4/23s100
    Dielectric BreakdownIPC-TM-650 2.5.6D-48/50+D-4/23kV63
    Dissipation Constant (Dk)IPC-TM-650 2.5.5.91MHz--4.8
    IEC 61189-2-72110GHz--
    Dissipation Factor (Df)IPC-TM-650 2.5.5.91MHz--0.013
    IEC 61189-2-72110GHz--
    Peel Strength (1Oz HTE copper foil)IPC-TM-650 2.4.8AN/mm
    After thermal Stress 288℃,10sN/mm1.38
    125℃N/mm1.07
    Flexural StrengthLWIPC-TM-650 2.4.4AMPa562
    CWIPC-TM-650 2.4.4AMPa518
    Water AbsorptionIPC-TM-650 2.6.2.1E-1/105+D-24/23%0.1
    CTIIEC60112ARatingPLC 3
    FlammabilityUL94C-48/23/50RatingV-0
    E-24/125RatingV-0
    Quality 1.6 MM Thickness PCB Electronic Board Half Hole FR4 Substrate 6 Layer PCB GPS Module for sale
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