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HDI Blind Buried Half Hole PCB 8 Layer OSP Immersion Gold

Witgain Technology Limited
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    Buy cheap HDI Blind Buried Half Hole PCB 8 Layer OSP Immersion Gold from wholesalers
     
    Buy cheap HDI Blind Buried Half Hole PCB 8 Layer OSP Immersion Gold from wholesalers
    • Buy cheap HDI Blind Buried Half Hole PCB 8 Layer OSP Immersion Gold from wholesalers
    • Buy cheap HDI Blind Buried Half Hole PCB 8 Layer OSP Immersion Gold from wholesalers
    • Buy cheap HDI Blind Buried Half Hole PCB 8 Layer OSP Immersion Gold from wholesalers
    • Buy cheap HDI Blind Buried Half Hole PCB 8 Layer OSP Immersion Gold from wholesalers

    HDI Blind Buried Half Hole PCB 8 Layer OSP Immersion Gold

    Ask Lasest Price
    Brand Name : WITGAIN PCB
    Model Number : Half hole PCB0016
    Certification : UL
    Price : negotiable
    Payment Terms : T/T
    Supply Ability : 100k pcs/month
    Delivery Time : 20 days
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    HDI Blind Buried Half Hole PCB 8 Layer OSP Immersion Gold

    8 Layer HDI PCB Half Hole Blind And Buried Holes OSP+Immersion Gold


    Board Info:


    1 Part NO: Half hole PCB0016


    2 Layer Count: 8 Layer PCB


    3 Finished Board Thickness: 1.0 MM tolerance is +/-0.1MM


    4 Solder Mask: Green


    5 Min Lind Space&Width: 3/3 mil


    6 Application Area: GPS Module


    7 Drilling: L1-L2 0.1MM, L2-L3 0.1MM, L3-L6 0.15MM, L6-L7 0.1MM, L7-L8 0.1MM, L1-L2 0.2MM Blind and Buried Holes


    Our Capabilities:


    NOItemCapability
    1Layer Count1-24 Layers
    2Board Thickness0.1mm-6.0mm
    3Finished Board Max Size700mm*800mm
    4Finished Board Thickness Tolerance+/-10% +/-0.1(<1.0mm)
    5Warp<0.7%
    6Major CCL BrandKB/NanYa/ITEQ/ShengYi/Rogers Etc
    7Material TypeFR4,CEM-1,CEM-3,Aluminum,Copper, Ceramic, PI, PET
    8Drill Hole Diameter0.1mm-6.5mm
    9Out Layer Copper Thickness1/2OZ-8OZ
    10Inner Layer Copper Thickness1/3OZ-6OZ
    11Aspect Ratio10:1
    12PTH Hole Tolerance+/-3mil
    13NPTH Hole Tolerance+/-1mil
    14Copper Thickness of PTH Wall>10mil(25um)
    15Line Width And Space2/2mil
    16Min Solder Mask Bridge2.5mil
    17Solder Mask Alignment Tolerance+/-2mil
    18Dimension Tolerance+/-4mil
    19Max Gold Thickness200u'(0.2mil)
    20Thermal Shock288℃, 10s, 3 times
    21Impedance Control+/-10%
    22Test CapabilityPAD Size min 0.1mm
    23Min BGA7mil
    24Surface TreatmentOSP, ENIG,HASL, Plating Gold, Carbon Oil,Peelable Mask etc

    IT180A Data Sheet:


    ItemsIPC TM-650Typical ValueUnit
    Peel Strength, minimum
    A. Low profile copper foil
    B. Standard profile copper foil
    2.4.85
    8
    lb/inch
    Volume Resistivity2.5.17.11x109M-cm
    Surface Resistivity2.5.17.11x108M
    Moisture Absorption, maximum2.6.2.10.10%
    Permittivity (Dk, 50% resin content)
    A. 1MHz
    B. 1GHz
    2.5.5.9
    2.5.5.9
    4.5
    4.4
    --
    Loss Tangent (Df, 50% resin content)
    A. 1MHz
    B. 1GHz
    2.5.5.9
    2.5.5.9
    0.014
    0.015
    --
    Flexural Strength, minimum
    A. Length direction
    B. Cross direction
    2.4.4500-530
    410-440
    N/mm2
    Thermal Stress 10 s at 288°C
    A. Unetched
    B. Etched
    2.4.13.1Pass PassRating
    FlammabilityUL94V-0Rating
    Comparative Tracking Index (CTI)IEC 60112 / UL 746CTI 3 (175-249)Class (Volts)
    Glass Transition Temperature(DSC)2.4.25175˚C
    Decomposition Temperature2.4.24.6345˚C
    X/Y Axis CTE (40℃ to 125℃)2.4.4111-13 / 13-15ppm/˚C
    Z-Axis CTE
    A. Alpha 1
    B. Alpha 2
    C. 50 to 260 Degrees C
    2.4.2445
    210
    2.7
    ppm/˚C ppm/˚C
    %
    Thermal Resistance
    A. T260
    B. T288
    2.4.24.1>60
    20
    Minutes Minutes
    Quality HDI Blind Buried Half Hole PCB 8 Layer OSP Immersion Gold for sale
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