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White Silkscreen 6 Layer PCB Black Solder Mask For Video Conference Device

Witgain Technology Limited
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    Buy cheap White Silkscreen 6 Layer PCB Black Solder Mask For Video Conference Device from wholesalers
     
    Buy cheap White Silkscreen 6 Layer PCB Black Solder Mask For Video Conference Device from wholesalers
    • Buy cheap White Silkscreen 6 Layer PCB Black Solder Mask For Video Conference Device from wholesalers
    • Buy cheap White Silkscreen 6 Layer PCB Black Solder Mask For Video Conference Device from wholesalers
    • Buy cheap White Silkscreen 6 Layer PCB Black Solder Mask For Video Conference Device from wholesalers
    • Buy cheap White Silkscreen 6 Layer PCB Black Solder Mask For Video Conference Device from wholesalers
    • Buy cheap White Silkscreen 6 Layer PCB Black Solder Mask For Video Conference Device from wholesalers

    White Silkscreen 6 Layer PCB Black Solder Mask For Video Conference Device

    Ask Lasest Price
    Brand Name : WITGAIN PCB
    Model Number : PCB000389
    Certification : UL
    Price : negotiable
    Payment Terms : T/T
    Supply Ability : 100k pcs/month
    Delivery Time : 20 days
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    White Silkscreen 6 Layer PCB Black Solder Mask For Video Conference Device

    6 Layer PCB Black Solder Mask White Silkscreen Used In Video Conference Devices


    Printed Circuit Board Features:


    1 6 Layer printed circuit board used in video conference devices.

    2 FR4 substrate material, tg 150 degree.

    3 Black solder mask and white silkscreen.

    4 ENIG, gold thickness 1U'

    5 Finished pcb thickness 1.0mm.

    6 35 um copper thcikness on each layer.

    7 PCB file or gerber file should be offered by customer.

    8 Customized printed circuit board.


    Packing Specifications:


    1 One vacuum pcb package should not be over 25 panels based on panel size.

    2 The vacuum pcb package sealed must be free to tear, hole or any defects that may cause leakage.

    3 The pcb package must be suitable to ensure effective vacuum sealing.

    4 Every package must have desiccant and humidity indicator card on the inside of vacuum package.

    5 Humidity indicator card target less than 10%.


    S1150G Data Sheet:


    S1150G
    ItemsMethodConditionUnitTypical Value
    TgIPC-TM-650 2.4.25DSC155
    TdIPC-TM-650 2.4.24.65% wt. loss380
    CTE (Z-axis)IPC-TM-650 2.4.24Before Tgppm/℃36
    After Tgppm/℃220
    50-260℃%2.8
    T260IPC-TM-650 2.4.24.1TMAmin>60
    T288IPC-TM-650 2.4.24.1TMAmin30
    Thermal StressIPC-TM-650 2.4.13.1288℃, solder dip--pass
    Volume ResistivityIPC-TM-650 2.5.17.1After moisture resistanceMΩ.cm6.4 x 107
    E-24/125MΩ.cm5.3 x 106
    Surface ResistivityIPC-TM-650 2.5.17.1After moisture resistance4.8 x 107
    E-24/1252.8 x 106
    Arc ResistanceIPC-TM-650 2.5.1D-48/50+D-4/23s140
    Dielectric BreakdownIPC-TM-650 2.5.6D-48/50+D-4/23kV45+kV NB
    Dissipation Constant (Dk)IPC-TM-650 2.5.5.91MHz--4.8
    IEC 61189-2-72110GHz--
    Dissipation Factor (Df)IPC-TM-650 2.5.5.91MHz--0.01
    IEC 61189-2-72110GHz--
    Peel Strength (1Oz HTE copper foil)IPC-TM-650 2.4.8AN/mm
    After thermal Stress 288℃,10sN/mm1.4
    125℃N/mm1.3
    Flexural StrengthLWIPC-TM-650 2.4.4AMPa600
    CWIPC-TM-650 2.4.4AMPa450
    Water AbsorptionIPC-TM-650 2.6.2.1E-1/105+D-24/23%0.1
    CTIIEC60112ARatingPLC 0
    FlammabilityUL94C-48/23/50RatingV-0
    E-24/125RatingV-0

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