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8 Laye HDI Printed Circuit Boards High Density PCB Interconnected Black Solder Mask

Witgain Technology Limited
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    Buy cheap 8 Laye HDI Printed Circuit Boards High Density PCB Interconnected Black Solder Mask from wholesalers
     
    Buy cheap 8 Laye HDI Printed Circuit Boards High Density PCB Interconnected Black Solder Mask from wholesalers
    • Buy cheap 8 Laye HDI Printed Circuit Boards High Density PCB Interconnected Black Solder Mask from wholesalers

    8 Laye HDI Printed Circuit Boards High Density PCB Interconnected Black Solder Mask

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    Brand Name : WITGAIN PCB
    Model Number : HDIPCB0007
    Certification : UL
    Price : negotiable
    Payment Terms : T/T
    Supply Ability : 100k pcs/month
    Delivery Time : 20 days
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    8 Laye HDI Printed Circuit Boards High Density PCB Interconnected Black Solder Mask

    HDI PCB High Density Interconnected 8 Layer Black Solder Mask


    Main Features:


    1 8 Layer HDI PCB, high density printed circuit board.

    2 Bline holes: L1-L2 0.1MM, L2-L3 0.1MM, L3-L4 0.1MM, L4-L5 0.1MM, L5-L6 0.1MM, L6-L7 0.1MM, L7-L8 0.1MM

    3 Buried holes: L4-L7 0.2MM.

    4 Via holes: L1-L8 0.2MM.

    5 PCB thickness is 1.0mm.

    6 Min BGA ball size is 10mil.

    7 Min line space and width is 2.5/2.5mil.

    8 Material is FR4 Substrate, tg180 degree

    9 S1000-2 material used.


    S1000-2 Material data sheet:


    S1000-2
    ItemsMethodConditionUnitTypical Value
    TgIPC-TM-650 2.4.25DSC180
    IPC-TM-650 2.4.24.4DMA185
    TdIPC-TM-650 2.4.24.65% wt. loss345
    CTE (Z-axis)IPC-TM-650 2.4.24Before Tgppm/℃45
    After Tgppm/℃220
    50-260℃%2.8
    T260IPC-TM-650 2.4.24.1TMAmin60
    T288IPC-TM-650 2.4.24.1TMAmin20
    T300IPC-TM-650 2.4.24.1TMAmin5
    Thermal StressIPC-TM-650 2.4.13.1288℃, solder dip--100S No Delamination
    Volume ResistivityIPC-TM-650 2.5.17.1After moisture resistanceMΩ.cm2.2 x 108
    E-24/125MΩ.cm4.5 x 106
    Surface ResistivityIPC-TM-650 2.5.17.1After moisture resistance7.9 x 107
    E-24/1251.7 x 106
    Arc ResistanceIPC-TM-650 2.5.1D-48/50+D-4/23s100
    Dielectric BreakdownIPC-TM-650 2.5.6D-48/50+D-4/23kV63
    Dissipation Constant (Dk)IPC-TM-650 2.5.5.91MHz--4.8
    IEC 61189-2-72110GHz--
    Dissipation Factor (Df)IPC-TM-650 2.5.5.91MHz--0.013
    IEC 61189-2-72110GHz--
    Peel Strength (1Oz HTE copper foil)IPC-TM-650 2.4.8AN/mm
    After thermal Stress 288℃,10sN/mm1.38
    125℃N/mm1.07
    Flexural StrengthLWIPC-TM-650 2.4.4AMPa562
    CWIPC-TM-650 2.4.4AMPa518
    Water AbsorptionIPC-TM-650 2.6.2.1E-1/105+D-24/23%0.1
    CTIIEC60112ARatingPLC 3
    FlammabilityUL94C-48/23/50RatingV-0
    E-24/125RatingV-0

    Packing Specifications:


    1 One vacuum pcb package should not be over 25 panels based on panel size.

    2 The vacuum pcb package sealed must be free to tear, hole or any defects that may cause leakage.

    3 The pcb package must be suitable to ensure effective vacuum sealing.

    4 Every package must have desiccant and humidity indicator card on the inside of vacuum package.

    5 Humidity indicator card target less than 10%.


    Quality 8 Laye HDI Printed Circuit Boards High Density PCB Interconnected Black Solder Mask for sale
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