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50ohm 8 Layer BGA Lead Free PCB AssemblyVideo Meeting Systems OSP Treatment

Witgain Technology Limited
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    Buy cheap 50ohm 8 Layer BGA Lead Free PCB AssemblyVideo Meeting Systems OSP Treatment from wholesalers
     
    Buy cheap 50ohm 8 Layer BGA Lead Free PCB AssemblyVideo Meeting Systems OSP Treatment from wholesalers
    • Buy cheap 50ohm 8 Layer BGA Lead Free PCB AssemblyVideo Meeting Systems OSP Treatment from wholesalers
    • Buy cheap 50ohm 8 Layer BGA Lead Free PCB AssemblyVideo Meeting Systems OSP Treatment from wholesalers
    • Buy cheap 50ohm 8 Layer BGA Lead Free PCB AssemblyVideo Meeting Systems OSP Treatment from wholesalers
    • Buy cheap 50ohm 8 Layer BGA Lead Free PCB AssemblyVideo Meeting Systems OSP Treatment from wholesalers
    • Buy cheap 50ohm 8 Layer BGA Lead Free PCB AssemblyVideo Meeting Systems OSP Treatment from wholesalers
    • Buy cheap 50ohm 8 Layer BGA Lead Free PCB AssemblyVideo Meeting Systems OSP Treatment from wholesalers
    • Buy cheap 50ohm 8 Layer BGA Lead Free PCB AssemblyVideo Meeting Systems OSP Treatment from wholesalers

    50ohm 8 Layer BGA Lead Free PCB AssemblyVideo Meeting Systems OSP Treatment

    Ask Lasest Price
    Brand Name : WITGAIN PCB
    Model Number : PCB0039
    Certification : UL
    Price : negotiable
    Payment Terms : T/T
    Supply Ability : 100k pcs/month
    Delivery Time : 20 days
    • Product Details
    • Company Profile

    50ohm 8 Layer BGA Lead Free PCB AssemblyVideo Meeting Systems OSP Treatment

    8 Layer PCB Used In Video Meeting Systems OSP Treatment


    Main Features:


    1 8 Layer Printed Circuit Board with very high relability.

    2 PCB drawing size is 192.5mm*120.28mm/2pcs

    3 Copper thickness is 35 um on each layer

    4 FR4 substrate material , TG170 degree.

    5 Surface treatment is OSP.

    6 BGA pad size 8.8mil.

    7 Finished board thickness is 1.2mm.

    8 Gerber file or PCB file should be offered by customer before production.

    9 Differential impedance control 50ohm


    S1000-2 Material Data Sheet:


    S1000-2
    ItemsMethodConditionUnitTypical Value
    TgIPC-TM-650 2.4.25DSC180
    IPC-TM-650 2.4.24.4DMA185
    TdIPC-TM-650 2.4.24.65% wt. loss345
    CTE (Z-axis)IPC-TM-650 2.4.24Before Tgppm/℃45
    After Tgppm/℃220
    50-260℃%2.8
    T260IPC-TM-650 2.4.24.1TMAmin60
    T288IPC-TM-650 2.4.24.1TMAmin20
    T300IPC-TM-650 2.4.24.1TMAmin5
    Thermal StressIPC-TM-650 2.4.13.1288℃, solder dip--100S No Delamination
    Volume ResistivityIPC-TM-650 2.5.17.1After moisture resistanceMΩ.cm2.2 x 108
    E-24/125MΩ.cm4.5 x 106
    Surface ResistivityIPC-TM-650 2.5.17.1After moisture resistance7.9 x 107
    E-24/1251.7 x 106
    Arc ResistanceIPC-TM-650 2.5.1D-48/50+D-4/23s100
    Dielectric BreakdownIPC-TM-650 2.5.6D-48/50+D-4/23kV63
    Dissipation Constant (Dk)IPC-TM-650 2.5.5.91MHz--4.8
    IEC 61189-2-72110GHz--
    Dissipation Factor (Df)IPC-TM-650 2.5.5.91MHz--0.013
    IEC 61189-2-72110GHz--
    Peel Strength (1Oz HTE copper foil)IPC-TM-650 2.4.8AN/mm
    After thermal Stress 288℃,10sN/mm1.38
    125℃N/mm1.07
    Flexural StrengthLWIPC-TM-650 2.4.4AMPa562
    CWIPC-TM-650 2.4.4AMPa518
    Water AbsorptionIPC-TM-650 2.6.2.1E-1/105+D-24/23%0.1
    CTIIEC60112ARatingPLC 3
    FlammabilityUL94C-48/23/50RatingV-0
    E-24/125RatingV-0

    FAQ:


    Q1:What is PCB Grid Testing or Bed of Nails Testing?

    A1: Grid testing or Bed of Nails testing is a process used to check the performance of components mounted on a PCB board. This test uses a frame/fixture that contains various pins inserted into an epoxy phenolic glass cloth laminated sheet (G-10) in order to access all the PCB test points. These pins act as sensors which are aligned to make contact with the test points on the PCB board and are also connected with a measuring unit through wires. The position of the pins is designed and customized for each PCB based on the components or points on the board that need to be tested.

    50ohm 8 Layer BGA Lead Free PCB AssemblyVideo Meeting Systems OSP Treatment

    A grid testing machine has three building blocks - a fixture, a bed of nails and software, to control the overall functionality of the machine. It usually has two cameras which are placed on the top and bottom of the machine in order to scan the whole board.

    Advantages of PCB Grid Testing:

    • Very Reliable method of PCB testing as all the points on the PCB board can be tested simultaneously.
    • Offers very good accuracy since it uses two cameras
    • Can easily detect manufacturing defects
    • An in-circuit tester is easy to program
    • Interpretation of test results is quite easy
    • It checks for Open, shorts, mission components, Wrong polarity, defective components, and current leakages in the circuit
    • Most of the parameters can be checked without applying power to the PCB under test

    Limitations of PCB Grid Testing:

    • Fixtures used in bed of nails testing are expensive since they are mechanical and require a different wiring assembly for a different PCB board
    • Fixtures are mechanical so any change in the number of pins or their position require extra cost
    • This test doesn’t test continuity through connectors so there are the chances that the connectors’ faults may remain unnoticed.
    • Faults related to solder joints, excess solder, solder quality, and solder void also remain unidentified

    This type of testing is called In-Circuit Testing. Another test process used for In-Circuit testing is Flying Probe Testing.


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