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Brand Name : | WITGAIN PCB |
Model Number : | PCB0073 |
Certification : | UL |
Price : | negotiable |
Payment Terms : | T/T |
Supply Ability : | 100k pcs/month |
Delivery Time : | 10 days |
Double Side PCB RO4350B High Frequency Material
1 2 Layer FR4 substrate material printed circuit board.
2 ROHS, MSDS, SGS, UL, ISO9001&ISO14001 Certificated.
3 RO4350B material, pcb thickness is 0.5 mm.
Features and Benefi ts: RO4000 materials are reinforced
hydrocarbon/ceramic laminates - not PTFE • Designed for performance
sensitive, high volume applications Low dielectric tolerance and
low loss • Excellent electrical performance • Allows applications
with higher operating frequencies • Ideal for broadband
applications Stable electrical properties vs. frequency •
Controlled impedance transmission lines • Repeatable design of fi
lters Low thermal coeffi cient of dielectric constant • Excellent
dimensional stability Low Z-axis expansion • Reliable plated
through holes Low in-plane expansion coeffi cient • Remains stable
over an entire range of circuit processing temperatures Volume
manufacturing process • RO4000 laminates can be fabricated using
standard glass epoxy processes • Competitively priced CAF resistant
Some Typical Applications: • Cellular Base Station Antennas and
Power Amplifi ers • RF Identifi cation Tags • Automotive Radar and
Sensors • LNB’s for Direct Broadcast Satellites
RO4000® hydrocarbon ceramic laminates are designed to offer
superior high frequency performance and low cost circuit
fabrication. The result is a low loss material which can be
fabricated using standard epoxy/glass (FR-4) processes offered at
competitive prices. The selection of laminates typically available
to designers is signifi cantly reduced once operational frequencies
increase to 500 MHz and above. RO4000 material possesses the
properties needed by designers of RF microwave circuits and
matching networks and controlled impedance transmission lines. Low
dielectric loss allows RO4000 series material to be used in many
applications where higher operating frequencies limit the use of
conventional circuit board laminates. The temperature coeffi cient
of dielectric constant is among the lowest of any circuit board
material (Chart 1), and the dielectric constant is stable over a
broad frequency range (Chart 2). For reduced insertion loss, LoPro®
foil is available (Chart 3). This makes it an ideal substrate for
broadband applications. RO4000 material’s thermal coeffi cient of
expansion (CTE) provides several key benefi ts to the circuit
designer. The expansion coeffi cient of RO4000 material is similar
to that of copper which allows the material to exhibit excellent
dimensional stability, a property needed for mixed dielectric
multi-layer boards constructions. The low Z-axis CTE of RO4000
laminates provides reliable plated through-hole quality, even in
severe thermal shock applications. RO4000 series material has a Tg
of >280°C (536°F) so its expansion characteristics remain stable
over the entire range of circuit processing temperatures. RO4000
series laminates can easily be fabricated into printed circuit
boards using standard FR-4 circuit board processing techniques.
Unlike PTFE based high performance materials, RO4000 series
laminates do not require specialized via preparation processes such
as sodium etch. This material is a rigid, thermoset laminate that
is capable of being processed by automated handling systems and
scrubbing equipment used for copper surface preparation. RO4003C™
laminates are currently offered in various confi gurations
utilizing both 1080 and 1674 glass fabric styles, with all confi
gurations meeting the same laminate electrical performance specifi
cation. Specifi cally designed as a drop-in replacement for the
RO4003C™ material, RO4350B™ laminates utilize RoHS compliant fl
ame-retardant technology for applications requiring UL 94V-0
certifi cation. These materials conform to the requirements of
IPC4103, slash sheet /10 for RO4003C, see note #1 for RO4350B slash
sheet determination.
Q1: What is pcb stiffner?
A1: When working with flexible PCBs there are times when we need
certain parts of the flexible printed circuit board to be rigid. We
do so by adding mechanical support to parts of the PCB. This
mechanical support is called a PCB Stiffener.
Flexible PCBs have many advantages like the capability to bend,
twist, and fold. However, it is challenging to add/solder
components and interconnects to these boards. A PCB Stiffener can
be used to make a part of the board more stable/rigid so that it
becomes easier to add/solder components or interconnects to the
stiffer parts of the board. PCB stiffeners are usually not an
integrated part of the PCB. They are only used to provide
mechanical support to certain parts of the board.
Other advantages of PCB stiffeners include the reinforcing of
solder joints, an increase in abrasion resistance and better
handling of the board for automated pick-and-place component
placement and soldering.
PCB stiffeners are usually made from FR4, Polyimide or aluminum.
The thickness of FR-4 stiffeners varies from 0.003"(0.08 mm) to
0.125" (3.18 mm). The polyimide stiffeners are available with a
thickness of 0.005" (125μm), 0.001" (25μm), 0.002" (50μm), and
0.003" (75μm). Polyimide stiffeners are usually a low-cost
alternative to FR-4 as they are punched on a die instead of routed
with a drill bit. To get better rigidity and heat sinking
properties, aluminum stiffeners are used.
There are two main methods to attached PCB Stiffeners to a flexible PCB - Thermal Bonding and Pressure-Sensitive Adhesives (PSA). The properties and differences of each approach have been highlighted in the table below:
Thermal Bonding | Pressure Sensitive Adhesives (PSA) |
Stiffeners are attached to the flex PCB by using heat and pressure | Stiffeners are attached with the flex PCB by only using pressure |
Stronger Bond | Bong not as strong |
Used in bonding in IPC class 3 product (Military application, Avionics etc.) | Used in bonding in IPC class 2 product (TV, laptops, Consumer electronics etc.) |
Higher Cost | Lower Cost |
Will cause significant damage to the circuit while removing from flex circuit. | Usually removed without damaging circuit, if care is taken while removing. |
Process take more time | Process takes less time |
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