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Blind Buried Holes Rapid Prototyping PCB 8 Layer HDI High TG170 FR4 Material

Witgain Technology Limited
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    Buy cheap Blind Buried Holes Rapid Prototyping PCB 8 Layer HDI High TG170 FR4 Material from wholesalers
     
    Buy cheap Blind Buried Holes Rapid Prototyping PCB 8 Layer HDI High TG170 FR4 Material from wholesalers
    • Buy cheap Blind Buried Holes Rapid Prototyping PCB 8 Layer HDI High TG170 FR4 Material from wholesalers
    • Buy cheap Blind Buried Holes Rapid Prototyping PCB 8 Layer HDI High TG170 FR4 Material from wholesalers
    • Buy cheap Blind Buried Holes Rapid Prototyping PCB 8 Layer HDI High TG170 FR4 Material from wholesalers
    • Buy cheap Blind Buried Holes Rapid Prototyping PCB 8 Layer HDI High TG170 FR4 Material from wholesalers
    • Buy cheap Blind Buried Holes Rapid Prototyping PCB 8 Layer HDI High TG170 FR4 Material from wholesalers
    • Buy cheap Blind Buried Holes Rapid Prototyping PCB 8 Layer HDI High TG170 FR4 Material from wholesalers
    • Buy cheap Blind Buried Holes Rapid Prototyping PCB 8 Layer HDI High TG170 FR4 Material from wholesalers

    Blind Buried Holes Rapid Prototyping PCB 8 Layer HDI High TG170 FR4 Material

    Ask Lasest Price
    Brand Name : WITGAIN PCB
    Model Number : HDIPCB0005
    Certification : UL
    Price : negotiable
    Payment Terms : T/T
    Supply Ability : 100kpcs/Month
    Delivery Time : 15-20 days
    • Product Details
    • Company Profile

    Blind Buried Holes Rapid Prototyping PCB 8 Layer HDI High TG170 FR4 Material

    8 Layer HDI PCB FR4 Material Blind And Buried Holes High TG170


    • Main Features:

    1 8 Layer HDI PCB with blind and buried holes.

    2 Green solder mask and immersion gold treatment.

    3 Min hole size is 0.1mm and min BGA size is 9mil.

    4 Finished board thickness is 0.8mm.

    5 The production cost will be higher than normal multilayer pcb and lead time will also be longer.

    6 Need 3 round laminations and 4 round drillings.

    7 2+N+2 hole structure: L1-L2 L2-L3 L1-L3 L7-L8 L6-L7 L6-L8 0.1MM, L3-L6 0.2MM, L1-L8 0.2MM.

    8 ROHS, MSDS, SGS, UL, ISO9001&ISO14001 Certificated.


    • Our Product Categories:

    Our Product Categories
    Material KindsLayer CountsTreatments
    FR4Single LayerHASL Lead Free
    CEM-12 Layer/Double LayerOSP
    CEM-34 LayerImmersion Gold/ENIG
    Aluminum Substrate6 LayerHard Gold Plating
    Iron Substrate8 LayerImmersion Silver
    PTFE10 LayerImmersion Tin
    PI Polymide12 LayerGold fingers
    AL2O3 Ceramic Substrate14 LayerHeavy copper up to 8OZ
    Rogers, Isola high frequency materials16 LayerHalf plating holes
    Halogen free18 LayerHDI Laser drilling
    Copper based20 LayerSelective immersion gold
    22 Layerimmersion gold +OSP
    24 LayerResin filled in vias

    • FAQ:

    Q1: What is Surface Mount PCB Assembly?

    A1: Surface mount in a PCB assembly means that each component on the PCB is mounted on the surface of the board. In the PCB Assembly process for surface mount components, solder paste is placed on the PCB board at areas where surface mount components will be placed on the board. PCB Stencils are usually used to apply solder paste on the PCB board and a pick and place machine is used to place SMT components on the board.

    Surface Mount Assembly is very cost effective, takes up less board space and requires short production times as compared to thru-hole assembly, as it does not require the drilling of holes through the board. However, the component grip is not as good as thru-hole and also the connection can be faulty if not soldered properly.


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