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HDI High Density Interconnected Printed Circuit Board Prototype PCB Blind Buried Hole

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    Buy cheap HDI High Density Interconnected Printed Circuit Board Prototype PCB Blind Buried Hole from wholesalers
     
    Buy cheap HDI High Density Interconnected Printed Circuit Board Prototype PCB Blind Buried Hole from wholesalers
    • Buy cheap HDI High Density Interconnected Printed Circuit Board Prototype PCB Blind Buried Hole from wholesalers
    • Buy cheap HDI High Density Interconnected Printed Circuit Board Prototype PCB Blind Buried Hole from wholesalers
    • Buy cheap HDI High Density Interconnected Printed Circuit Board Prototype PCB Blind Buried Hole from wholesalers
    • Buy cheap HDI High Density Interconnected Printed Circuit Board Prototype PCB Blind Buried Hole from wholesalers
    • Buy cheap HDI High Density Interconnected Printed Circuit Board Prototype PCB Blind Buried Hole from wholesalers

    HDI High Density Interconnected Printed Circuit Board Prototype PCB Blind Buried Hole

    Ask Lasest Price
    Brand Name : WITGAIN PCB
    Model Number : HDIPCB0009
    Certification : UL
    Price : negotiable
    Payment Terms : T/T
    Supply Ability : 100k pcs/month
    Delivery Time : 20 days
    • Product Details
    • Company Profile

    HDI High Density Interconnected Printed Circuit Board Prototype PCB Blind Buried Hole

    HDI PCB High Density Interconnected Printed Circuit Board With Blind And Buried Holes


    • Main Features:

    1 10 Layer HDI PCB, high density printed circuit board.

    2 Bline holes: L1-L2 0.1MM, L2-L3 0.1MM, L9-L10 0.1MM, L8-L9 0.1MM

    3 Buried holes: L4-L7 0.2MM.

    4 Via holes: L1-L10 0.2MM.

    5 PCB thickness is 1.0mm.

    6 Min BGA ball size is 8mil.

    7 Min line space and width is 3/3mil.

    8 Material is FR4 Substrate, tg180 degree

    9 S1000-2 material used.


    • S1000-2 Material data sheet:

    S1000-2
    ItemsMethodConditionUnitTypical Value
    TgIPC-TM-650 2.4.25DSC180
    IPC-TM-650 2.4.24.4DMA185
    TdIPC-TM-650 2.4.24.65% wt. loss345
    CTE (Z-axis)IPC-TM-650 2.4.24Before Tgppm/℃45
    After Tgppm/℃220
    50-260℃%2.8
    T260IPC-TM-650 2.4.24.1TMAmin60
    T288IPC-TM-650 2.4.24.1TMAmin20
    T300IPC-TM-650 2.4.24.1TMAmin5
    Thermal StressIPC-TM-650 2.4.13.1288℃, solder dip--100S No Delamination
    Volume ResistivityIPC-TM-650 2.5.17.1After moisture resistanceMΩ.cm2.2 x 108
    E-24/125MΩ.cm4.5 x 106
    Surface ResistivityIPC-TM-650 2.5.17.1After moisture resistance7.9 x 107
    E-24/1251.7 x 106
    Arc ResistanceIPC-TM-650 2.5.1D-48/50+D-4/23s100
    Dielectric BreakdownIPC-TM-650 2.5.6D-48/50+D-4/23kV63
    Dissipation Constant (Dk)IPC-TM-650 2.5.5.91MHz--4.8
    IEC 61189-2-72110GHz--
    Dissipation Factor (Df)IPC-TM-650 2.5.5.91MHz--0.013
    IEC 61189-2-72110GHz--
    Peel Strength (1Oz HTE copper foil)IPC-TM-650 2.4.8AN/mm
    After thermal Stress 288℃,10sN/mm1.38
    125℃N/mm1.07
    Flexural StrengthLWIPC-TM-650 2.4.4AMPa562
    CWIPC-TM-650 2.4.4AMPa518
    Water AbsorptionIPC-TM-650 2.6.2.1E-1/105+D-24/23%0.1
    CTIIEC60112ARatingPLC 3
    FlammabilityUL94C-48/23/50RatingV-0
    E-24/125RatingV-0

    • FAQ:

    Q1: What is HDI PCB?

    A1: HDI is the abbreviation of high density interconnector. Generally, there are blind and buried holes in HDI PCB. Due to the space limits, some product need to very small size pcb. HDI pcb was generated to save space and increase interconnectors.


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