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Selective 6 Layer HDI Immersion Gold PCB With Blind / Buried Holes

Witgain Technology Limited
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    Buy cheap Selective 6 Layer HDI Immersion Gold PCB With Blind / Buried Holes from wholesalers
     
    Buy cheap Selective 6 Layer HDI Immersion Gold PCB With Blind / Buried Holes from wholesalers
    • Buy cheap Selective 6 Layer HDI Immersion Gold PCB With Blind / Buried Holes from wholesalers
    • Buy cheap Selective 6 Layer HDI Immersion Gold PCB With Blind / Buried Holes from wholesalers
    • Buy cheap Selective 6 Layer HDI Immersion Gold PCB With Blind / Buried Holes from wholesalers
    • Buy cheap Selective 6 Layer HDI Immersion Gold PCB With Blind / Buried Holes from wholesalers

    Selective 6 Layer HDI Immersion Gold PCB With Blind / Buried Holes

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    Brand Name : WITGAIN PCB
    Model Number : HDIPCB0011
    Certification : UL
    Price : negotiable
    Payment Terms : T/T
    Supply Ability : 100kpcs/Month
    Delivery Time : 25 days
    • Product Details
    • Company Profile

    Selective 6 Layer HDI Immersion Gold PCB With Blind / Buried Holes

    Selective Immersion Gold 6 Layer HDI PCB With Blind Holes And Buried Holes


    PCB Specifications:


    1 Part NO: HDIPCB0011

    2 Layer Count: 6 Layer HDI PCB

    3 Finished Board Thickness: 1.0MM

    4 Drilling: L1-L2 0.1MM, L2-L5 0.2MM, L5-L6 0.1MM, L1-L6 0.2MM

    5 Min Lind Space&Width: 2.8/2.7mil

    6 Copper Thickness: 1/H/H/H/H1

    7 Application Area: Smart Watch

    8 PCB Size: 113.1MM*101.1MM/6PCS


    Our production applications:


    1 Consumer electronic products: SSD, TWS earphones, headsets,computer devices, portable power supplies, bluetooth modules, gps modules, wifi modules, smart keys for cars, intelligent locks, floor mopping robots, zigbee, etc.

    2 Industrial control:main boards in machines, industrial robots, servo motors etc.

    3 Automotive: BMS main boards, automotive radar etc.

    4 Power supplies: UPS, industrial power supply, frequency power supply.

    5 Medical: medical equipment, medical equipment power supply.

    6 Communication products: 5G base station, routers, satellites, antennas.

    7 Photovoltaic inverter



    IT180A DATA SHEET:


    ItemsIPC TM-650Typical ValueUnit
    Peel Strength, minimum
    A. Low profile copper foil
    B. Standard profile copper foil
    2.4.85
    8
    lb/inch
    Volume Resistivity2.5.17.11x109M-cm
    Surface Resistivity2.5.17.11x108M
    Moisture Absorption, maximum2.6.2.10.10%
    Permittivity (Dk, 50% resin content)
    A. 1MHz
    B. 1GHz
    2.5.5.9
    2.5.5.9
    4.5
    4.4
    --
    Loss Tangent (Df, 50% resin content)
    A. 1MHz
    B. 1GHz
    2.5.5.9
    2.5.5.9
    0.014
    0.015
    --
    Flexural Strength, minimum
    A. Length direction
    B. Cross direction
    2.4.4500-530
    410-440
    N/mm2
    Thermal Stress 10 s at 288°C
    A. Unetched
    B. Etched
    2.4.13.1Pass PassRating
    FlammabilityUL94V-0Rating
    Comparative Tracking Index (CTI)IEC 60112 / UL 746CTI 3 (175-249)Class (Volts)
    Glass Transition Temperature(DSC)2.4.25175˚C
    Decomposition Temperature2.4.24.6345˚C
    X/Y Axis CTE (40 to 125)2.4.4111-13 / 13-15ppm/˚C
    Z-Axis CTE
    A. Alpha 1
    B. Alpha 2
    C. 50 to 260 Degrees C
    2.4.2445
    210
    2.7
    ppm/˚C ppm/˚C
    %
    Thermal Resistance
    A. T260
    B. T288
    2.4.24.1>60
    20
    Minutes Minutes

    FAQ:

    Q1: What is the Thermal Resistance of a PCB?

    A1: Thermal Resistance is a property of a printed circuit board that specifies its resistance to heat dispersion. A low thermal resistance in a PCB makes the dispersion of heat easier. This is basically the inverse of thermal conductivity. The thermal resistance of a PCB can be calculated by evaluating all the layers of the board and the heat parameters of the material.

    To find the total thermal resistance for your board, you must include all layers of the board and the associated heat parameters for the type of material through which heat will flow.


    [Formula]

    R_theta = absolute thermal resistance (K/W) across the thickness of the sample

    Delta x = thickness (m) of the sample (measured on a path parallel to the heat flow)

    k = thermal conductivity (W/(K·m)) of the sample

    A = cross-sectional area (m2) perpendicular to the path of heat flow


    In addition to the thermal resistance of the board. The Thermal resistance of Vias must also be calculated. This usually depends on the copper trance, the laminate and the substrate and their respective thermal resistivities.

    How can you reduce the Thermal Resistance of a PCB?

    • Thermal resistance can be reduced by increasing the thickness of the copper traces.
    • Another method to decrease the thermal resistance is to place copper pads below the hot components. The high thermal conductivity of copper provides a low resistance path for the dispersion of heat. These pads can be connected to an internal ground plane through vias, which have good thermal conductivity and thus help move heat away from the component.
    • Using Heat Sinks can help lower the thermal resistivity of the board.

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