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Aluminum Nitride Ceramic PCB Board 0.4 MM 1 OZ Copper

Witgain Technology Limited
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    Buy cheap Aluminum Nitride Ceramic PCB Board 0.4 MM 1 OZ Copper from wholesalers
     
    Buy cheap Aluminum Nitride Ceramic PCB Board 0.4 MM 1 OZ Copper from wholesalers
    • Buy cheap Aluminum Nitride Ceramic PCB Board 0.4 MM 1 OZ Copper from wholesalers

    Aluminum Nitride Ceramic PCB Board 0.4 MM 1 OZ Copper

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    Brand Name : WITGAIN PCB
    Model Number : CeramicPCB0007
    Certification : UL
    Price : negotiable
    Payment Terms : T/T
    Supply Ability : 100k pcs/month
    Delivery Time : 20 days
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    Aluminum Nitride Ceramic PCB Board 0.4 MM 1 OZ Copper

    AIN Ceramic PCB Board Thickness 0.4 MM 1 OZ Copper


    Main Features:

    1 Part NO: CeramicPCB0007
    2 Layer Count: 2 Layer PCB
    3 Material Kind: AIN Ceramic
    4 Finished Board Thickness: 0.4 MM
    5 Copper Thickness: 1/1 OZ
    6 PCB Size: 100mm*100mm



    Our Product Categories:

    Our Product Categories
    Material KindsLayer CountsTreatments
    FR4Single LayerHASL Lead Free
    CEM-12 Layer/Double LayerOSP
    CEM-34 LayerImmersion Gold/ENIG
    Aluminum Substrate6 LayerHard Gold Plating
    Iron Substrate8 LayerImmersion Silver
    PTFE10 LayerImmersion Tin
    PI Polymide12 LayerGold fingers
    AL2O3 Ceramic Substrate14 LayerHeavy copper up to 8OZ
    Rogers, Isola high frequency materials16 LayerHalf plating holes
    Halogen free18 LayerHDI Laser drilling
    Copper based20 LayerSelective immersion gold
    22 Layerimmersion gold +OSP
    24 LayerResin filled in vias



    FAQ:

    Q: What is HASL - Hot Air Solder Leveling?

    A:

    Aluminum Nitride Ceramic PCB Board 0.4 MM 1 OZ Copper

    HASL (Hot Air Solder Leveling) is a metallic surface finishing technique, which is performed on the outermost layer of the PCB board to protect the exposed copper surfaces like tracks until the component placement and soldering is completed.

    The HASL coating is composed of Solder with 63% Tin and 37% Lead, and during the assembly process, this coating gets dissolved with the soldering material.

    Aluminum Nitride Ceramic PCB Board 0.4 MM 1 OZ Copper

    The HASL Coating is applied as per the steps below:

    1. The process starts with the immersion of the PCB board into a molten tin/lead solution, where all exposed copper area is covered by this solution.
    2. After that, a Hot Air Leveler (HAL) ensures the uniformity of solder deposit by removing the excess solder from the PCB board, using high pressure hot air knives. The purpose of this is to leave a uniform and thin possible layer on the board.
    3. This coating protects the copper traces from corrosion until the board goes in for the assembly process.

    Aluminum Nitride Ceramic PCB Board 0.4 MM 1 OZ Copper

    Advantages of HASL:

    • Resistance to copper corrosion
    • Excellent wetting capability during the soldering process
    • Provides excellent quality solder joint (solderability) by making component soldering more effective
    • Economical
    • Can be re-worked easily
    • Suitable for Lead-free PCBs
    • Reduce the chances of PCB failure

    Limitations of HASL:

    • It offers high thermal stress to the PCB, which results in defects.
    • Due to the inconsistent thickness of HASL coating, it’s not a feasible solution for SMT component placement.
    • Not suitable for PTH (Plated Through Hole) components.
    • Less environment-friendly
    Quality Aluminum Nitride Ceramic PCB Board 0.4 MM 1 OZ Copper for sale
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