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AL2O3 Ceramic PCB Board Thickness 2.3MM 3OZ Copper

Witgain Technology Limited
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    Buy cheap AL2O3 Ceramic PCB Board Thickness 2.3MM 3OZ Copper from wholesalers
     
    Buy cheap AL2O3 Ceramic PCB Board Thickness 2.3MM 3OZ Copper from wholesalers
    • Buy cheap AL2O3 Ceramic PCB Board Thickness 2.3MM 3OZ Copper from wholesalers

    AL2O3 Ceramic PCB Board Thickness 2.3MM 3OZ Copper

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    Brand Name : WITGAIN PCB
    Model Number : CeramicPCB0005
    Certification : UL
    Price : negotiable
    Payment Terms : T/T
    Supply Ability : 100k pcs/month
    Delivery Time : 20 days
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    AL2O3 Ceramic PCB Board Thickness 2.3MM 3OZ Copper

    AL2O3 Ceramic PCB Board Thickness 2.3MM 3/3OZ Copper


    Main Features:

    1 Part NO: CeramicPCB0005
    2 Layer Count: 2 Layer PCB
    3 Material Kind: AL203 Ceramic
    4 Finished Board Thickness: 2.3MM
    5 Copper Thickness: 3/3OZ
    6 PCB Size: 120MM*100MM
    7 Application Area: RF Power Supply


    Our Product Categories:

    Our Product Categories
    Material KindsLayer CountsTreatments
    FR4Single LayerHASL Lead Free
    CEM-12 Layer/Double LayerOSP
    CEM-34 LayerImmersion Gold/ENIG
    Aluminum Substrate6 LayerHard Gold Plating
    Iron Substrate8 LayerImmersion Silver
    PTFE10 LayerImmersion Tin
    PI Polymide12 LayerGold fingers
    AL2O3 Ceramic Substrate14 LayerHeavy copper up to 8OZ
    Rogers, Isola high frequency materials16 LayerHalf plating holes
    Halogen free18 LayerHDI Laser drilling
    Copper based20 LayerSelective immersion gold
    22 Layerimmersion gold +OSP
    24 LayerResin filled in vias



    FAQ:

    Q1:What are Copper Clad Laminates?
    A1: A copper clad laminate is a laminate that has copper foil as its conducting layer. Laminates form the core of a PCB. It consists of layers of metal foil and prepreg (resin + reinforcement material) laminated together with heat and pressure. A laminate used for Printed Circuit Boards can have many different types of metal foil as its conducting layer. These include copper, aluminum, uranium, gold, palladium, carbon fiber, graphite etc. However, copper is used the most due to its excellent electrical characteristics and low cost.

    Copper Clad Laminates are classified based on the copper weight, type of resin used, Reinforcement type, glass transition temperature, and various thermal and electrical properties.

    The copper foil which is used as the conducting layer of the laminate is available in different specifications as laid out in IPC-4101. This standard also specifies the reinforcement type, the resin system the glass transition temperature range and flammability requirements for making quality copper clad laminate.

    Copper Weight: Copper Weight or Copper Thickness in a Printed Circuit Board represents the thickness of 1 ounce of copper rolled out over an area of 1 square foot. It determines the current carrying capacity of a PCB. This is an important parameter that needs to be specified when selecting a copper clad laminate.

    Resin: The type of resin used determines the mechanical properties related to stress and strain bearing capacity of the laminate and the thermal characteristics like the rate of expansion and curing properties, which again determine its rate of cross linking among molecular chains which determine its decomposition and glass transition temperature.

    Phenolic Epoxy Polyester
    PTFE Polyamide/Epoxy Epoxy/Multi Functional Epoxy
    Bismaleimide Triazine(BT) Polyamide Polyimide Cyanate Ester
    Cyanate Ester Epoxy/Phenolic Flame Resistant
    Reinforcement: The choice of reinforcement used while manufacturing the laminate determines its tooling and drilling characteristics. Cotton and cellulose based laminates do not need to be drilled and can be punched to make a hole in it. Laminates made from a fiber of any kind like, glass, mat glass and quartz require special drilling practices, like closely monitoring the rate of wear of drill bit, the pressure applied to the drill bit and the spindle speed. This is because the thickness and granularity of the glass fibers, the thickness of the copper foil have a huge impact on the number of times a drill bit can be used, which ultimately has an impact on the final cost of making the laminate.

    Cotton Paper
    Woven Glass
    Mat Glass
    Cotton Paper/Woven Glass
    Woven Glass/Mat Glass
    Mat Glass/ Glass Veil
    Woven Aramid
    Woven Quartz Fiber
    Woven E-Glass Surface/Cellulose Paper Core
    A copper clad laminate is basically a combination of these layers. The combination determines various mechanical, physical, thermal and electrical properties of the laminate. The properties include the Glass Transition Temperature, the coefficient of thermal expansion. Electrical properties of the board include Dielectric Constant, loss tangent, insulation Resistance, surface resistivity and various other parameters.


    Quality AL2O3 Ceramic PCB Board Thickness 2.3MM 3OZ Copper for sale
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